Lead Package Assembly Integration Engineer (Laser Modules)

Lightmatter is seeking a Lead Package Integration Engineer to spearhead the development of advanced semiconductor laser modules. In this high-impact role, you will be responsible for defining the packaging roadmap that enables our next-generation photonic computing platforms. You will lead a multi-disciplinary technical team to solve complex thermal, mechanical, and optical challenges, bridging the gap between chip-level design and system-level integration. If you thrive at the intersection of traditional semiconductor packaging and cutting-edge silicon photonics, we want to hear from you.

Responsibilities

• Drive the end-to-end design, analysis, and execution of advanced laser module packaging, overseeing thermal, mechanical, optical, and electrical workstreams.
• Lead the assembly process definition for flip chip and wirebond approaches and substrate or PCB technology selection.
• Specify fiber attach methods and optical connector strategies to ensure low-loss, high-reliability coupling.
• Identify key reliability risks under product use conditions. Plan and execute Design of Experiments (DOE) and perform data analysis to improve product mechanical integrity and assembly yields.
• Direct external partners and OSATs to ensure seamless technology transfer and high-volume manufacturability.
• Partner with the Silicon Photonics, Systems, Test and Reliability teams to evaluate architectural trade-offs and deliver optimized hardware solutions.
• Summarize and communicate to key stakeholders across Lightmatter, suppliers and customers as required.
• Write reports and document methodologies.

Required Qualifications

• MS or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
• 8+ years of experience in semiconductor packaging or micro-electronics assembly.
• Experience and deep knowledge of traditional and advanced packaging technologies, materials science, and supply chain dynamics.
• Proficiency in flip chip and wirebond integration, including a strong grasp of design rules for advanced substrates (HDBU, MSAP, HDI).
• Proven ability to drive thermal, mechanical, and electrical simulations and analysis.

Preferred Qualifications

• Hands-on experience with Silicon Photonics and the integration of semiconductor lasers (III-V).
• Specific experience in design and manufacturing of Transceivers, Laser Module Assembly for Datacom or precision optical alignment.
• Established track record of managing high-tier OSATs and specialized material suppliers.
• Ability to work independently and tackle projects with minimal supervision.
• Strong creative thinking skills with the ability to solve problems quickly.
• Exceptional written and verbal communication skills; ability to summarize complex technical data for executive stakeholders.