Quantum Advanced Packaging Engineer
About Us
QuantWare is building the world’s most powerful quantum processors to solve humanity's greatest challenges. We do this with our unique VIO™ technology, the only QPU architecture that breaks the hardware barriers that have held quantum computing back, unlocking the path to MegaQubit quantum processors.
With VIO, we are paving the way for the hyper-scale quantum computers that will change the world. And delivering on that vision demands people who don’t shy away from tackling the hardest challenges of our time. That’s where you come in!
As an Advanced Packaging Engineer for quantum technologies you will lead a critical part of the research and development of our chiplet technologies and 3D architecture system for scalable quantum computing processors. You’ll work as part of a multidisciplinary R&D team responsible for designing, fabricating, prototyping, assembling, and testing the critical building blocks of a novel 3D architecture for next-generation quantum computers. In this role, you will drive and guide the development of our chip layers from concept to implementation, playing a key role in advancing our quantum hardware platform.
What you’ll be doing:
Drive R&D activities from early concept through prototyping to manufacturable processes - including contributing hands-on - to new packaging and assembly techniques, using novel fabrication methods, and assembly techniques and tools.
Lead, mentor, and inspire development of advanced packaging techniques for quantum hardware applications.
Collaborate with external partners and vendors, managing outsourced activities and ensuring seamless integration of external technologies into our products.
Allocate resources and time strategically, balancing workload across different development activities, coordinating cross-functional contributions, and aligning priorities with company objectives.
Foster a culture of innovation and accountability, ensuring the team delivers technical excellence while adapting to the fast pace of a scale-up environment.
Your profile
You don’t need to tick every box, but if most of these apply, we’d love to hear from you:
Technical Background
Master’s degree (or higher) in physics, electronics, materials science, or a related field.
4+ years of experience in hardware R&D, ideally within semiconductor packaging development in general.
Proven ability to deliver solutions to outstanding similar technical challenges.
It would be a plus if you bring experience with:
Semiconductor processing, Semiconductor chip integration, flip-chip, advanced packaging techniques.
Knowledgeable about packaging related simulation tools, thermal management, mechanical stress, and reliability in complex hardware systems.
Leadership
Proven track record leading R&D activities in a relevant field.
Strong communication skills: able to deliver complex development challenges and projects under uncertainty.
Comfortable building scalable processes in a scale-up/startup environment.
Excellent communication skills, with the ability to engage both engineers and business stakeholders.
Good management skills, including coaching, developing talent, and conflict resolution.
Collaborative, structured and pragmatic.
Diversity & Inclusion at QuantWare
At QuantWare, we’re committed to building a diverse and inclusive team where everyone feels respected, valued, and empowered to contribute. We believe that varied perspectives drive better decisions, foster innovation, and strengthen our work.
If you’re excited about this opportunity but don’t meet every single requirement, we still encourage you to apply. You might bring a unique perspective or skill set that makes you a great fit for our team.
As part of our recruitment process, candidates may be required to undergo pre-employment screening.