Senior Photonic III-V Engineer
$220k - $270k USD
About the Team:
Born at X, Google's Moonshot Factory, Taara is on a mission to connect billions of people lacking abundant and affordable internet by pioneering high-throughput and long-range free-space optical communication (FSOC). Links use eye-safe lasers propagating between two terminals to wirelessly transmit high speed data. Lead the charge in bringing our groundbreaking wireless optical communication to the world. Drive our growth story as we scale innovative solutions across the world. Join us to light the way for bridging the digital divide and illuminating the future.
About the Role:
Taara is seeking a Senior Photonic III-V Engineer working on next generation photonic and electronic integrated modules as part of the R&D team developing cutting-edge wireless optical communication systems. The successful candidate will own III-V development efforts for Taara. This includes physical modeling, supplier management, characterization and package implementation of III-V devices. The role requires deep knowledge of DFB and SOA design, related supplier ecosystems, characterization, and packaging. The position seeks highly-motivated individuals who thrive in ambiguity and enjoy working in a small dynamic team environment, with a passion for solving challenging problems that can lead to high-impact advances in technology.
How you will make 10x impact:
Develop novel III-V devices and their packaging implementation.
Manage supplier ecosystems and optimize devices and packaging for manufacturability and reliability.
Contribute to system-level optimization and product strategy.
Be motivated by making the world a better place through technology, and wanting to be part of a team that makes this happen.
What you should have:
M.S. in Electrical Engineering, Applied Physics, Materials Science or related field
Five (5) or more years relevant industry experience with demonstrated achievements in III-V development
Experience with III-V DFB and SOA modeling, characterization, and packaging implementation.
Experience with photonic simulation software (PICS3D, Lumerical, PhotonD or equivalent)
Experience working with III-V foundries, suppliers, and assembly and test vendors.
Experience with optimization of III-V devices and packaging towards manufacturability and reliability.
Experience with III-V DFB & SOA failure analysis, and parts inspection.
It would be great if you also had these:
Ph.D. in Electrical Engineering, Materials Science, Applied Physics or related field.
Experience with thermo-mechanical simulations (Ansys, Altair, Siemens, or equivalent).
Experience with III-V to SiPh coupling, microphotonic packaging, and micro-lense assemblies.
Experience with optical assembly simulation software (Zemax or equivalent)
Excellent communication and presentation skills (writing and delivering presentations), can work with senior external partners with ease.
Hands-on experience in advancing product from prototype to final production stage
The US base salary range for this full-time position is $220,000 - $270,000 (inclusive of bonus at target) + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your location during the hiring process.