Process Engineer - Dice, Grind & CMP
Silex Microsystems is the world’s leading pure-play MEMS foundry, customizing solutions for prominent global clients in industries such as pharmaceuticals, consumer electronics, and automotive. As a Process Engineer, you will initiate and drive progress in the Backend area. Sounds interesting? Keep reading.
Would you like to know more about Silex and what we do? Read more here.
About the team
Silex Backend team consists of 20 engineers and technicians and are responsible for a wide range of equipment and technologies at Silex, including electrical test, AOI, manual inspection, wafer dicing, wafer thinning and CMP.
The Dice, Grind & CMP team currently consists of four process engineers, and we are looking to expand our team as we are investing in new equipment that will expand our processing capabilities and introduce new technology to Silex.
About the Role
Develop and optimize Dice, Grind and CMP processes to ensure high production capacity and quality.
Conduct experiments to understand process performance and identify improvement opportunities.
Collaborate with other team members to solve production-related challenges and optimize process flow.
Perform quality controls and ensure we meet industry standards and customer requirements. Preferably with experience in statistical analysis methods such as Measurement System Analysis (MSA), Gage R&R, Design of Experiment (DOE) and Statistical Process Control (SPC).
Participate in procurement, installation and qualification of new equipment.
We are looking for someone who has:
MSc or PhD in physics, materials science, chemical engineering, electronics, or another related field.
A structured and data-driven approach to process development and optimization.
Familiar with different metrology techniques (e.g. optical measurements, ellipsometry, AFM).
The ability to work independently as well as in team environments.
A strong interest in semiconductor processing and cleanroom manufacturing.
Good communication skills in English; Swedish is a merit.
Previous experience with blade dicing, stealth dicing, wafer grinding, or CMP is highly valued.
At Silex, we are driven by development – both for each person in their own role and in our processes. We are looking for people who want to develop with us. We welcome experience from the semiconductor industry, especially if you have experience with Dice and CMP.
More about the Recruitment
We apply an ongoing recruitment process and therefore wish to receive your application as soon as possible. To submit your application, please attach your CV and answer a few questions.
In the process, we work competency-based and it will include a personality and logic test as well as reference checks. We will also conduct both a background check and a drug test before employment.