Senior High Speed Mixed-Signal Engineer
About Manna
At Manna, we’re changing how the world receives things — by taking delivery to the skies.
Our mission is simple but ambitious: to make high-speed suburban delivery affordable, green, and safe. We design and build our own aviation-grade drones that deliver food, coffee, groceries, and more directly from local stores and vendors to people’s doors in just a few minutes.
We’re a team that Drive with Impact, are Safety Focused, and knows that the best ideas come from Team Players who show up as their Authentic Selves. We move fast, we are passionate about what we do, and we’re always pushing a growth mindset to be better in everything we do.
If you want to build world-changing technology with real-world impact (and have a bit of fun while doing it), you’ll love it here.
Welcome to Manna — where we deliver the future.
Role Purpose
To design and deliver high‑performance embedded electronic systems by developing robust high‑speed digital, mixed‑signal, analog, and power architectures. The role ensures reliable, safe, and compliant hardware through strong signal and power integrity practices, advanced PCB design, battery system integration, and successful bring‑up of microcontroller‑ and microprocessor‑based platform.
Responsibilities
Own the design and delivery of complex mixed-signal hardware subsystems from concept through production.
Own schematic design and PCB layout across technologies such as HDI, rigid-flex, flex, aluminum-core, and heavy-copper boards.
Lead high-speed digital interface design, including Ethernet, USB 3.x, CAN, I²C, RS-485, DDR and similar embedded communication standards.
Apply strong signal integrity principles to high-speed layouts, including impedance control, length matching, termination strategy selection, and mitigation of reflection and crosstalk issues.
Architect and implement robust power systems, including LDO and SMPS regulator design, power integrity optimisation, thermal constraints, and noise/PSRR performance management.
Support validation of battery solutions and battery management systems (BMS), including cell monitoring, protection circuitry, balancing strategies, and SOC/SOH estimation integration.
Integrate and bring up microcontrollers and microprocessors, including clocking, power sequencing, peripheral configuration, and interface validation.
Design for EMC/ESD compliance from the outset, ensuring conducted and radiated emissions and immunity performance in line with FCC, CE, and ETSI requirements.
Apply Design for Manufacturability and Assembly (DFM/DFA) principles to optimise cost, yield, reliability, and production scalability and support certification, qualification testing, and transition to manufacturing.
Requirements
High-speed and embedded digital interface design, including DDR, Ethernet, USB 3.x, and common control interfaces (e.g., CAN, I²C, RS-485)
Strong signal integrity fundamentals, including noise immunity, reflection and crosstalk management, impedance and length control and appropriate termination strategies
Mixed-signal schematic capture and PCB layout, with experience across advanced PCB technologies such as HDI, flex, rigid-flex, aluminum-core, and heavy-copper boards
Experience with battery management systems (BMS), including cell monitoring, protection mechanisms, balancing, and SOC/SOH estimation.
Integration and configuration of microcontrollers and microprocessors, including peripheral setup, clocking, power, and interface bring-up
Design for EMC and ESD compliance, addressing conducted and radiated emissions and immunity in line with relevant FCC, CE, and ETSI requirements
Power integrity design, including optimisation of LDO and SMPS regulators, consideration of thermal constraints, and management of noise and PSRR requirements
Sensitive analog circuit design, including signal conditioning for sensors, ADCs, and DACs, noise management, filtering, and layout-dependent effects
Hands-on debugging using scope, logic analyser, spectrum analyser etc.
Thermal design considerations in mixed-signal systems, including component placement, power dissipation, and their impact on signal integrity and performance.
Design for manufacturability and assembly (DFM/DFA), with attention to component selection, tolerances, assembly constraints, and yield