TO BE CONSIDERED, APPLY AT www.zin-tech.com/careers
Conduct thermal analysis on a variety of system and component level items using FEMAP Thermal and
FEMAP Flow (MAYA TMG Solver) based FEA modeling per NASA and/or
Aerospace accepted standards. Work with project engineers to develop
thermal models of hardware design and be able to intrepret analysis
results for design modification and/or identify area of interest to
verify by testing. Validate thermal models using simple experimental
set-ups. Generate reports to capture analytical and practical model
validation. Support thermal testing including developing thermal test
plan, conducting test, and reporting results.
U.S. CITIZENSHIP REQUIRED
POSSIBLE RELOCATION ASSISTANCE
Bachelors of Mechanical or Aerospace Engineering with 3-5 years experience with
emphasis on thermal modeling and heat transfer/thermal experimentation.
Candidate should be comfortable using FEMAP pre/post finite element
modeling software or equivalent and be able to use hand calculation to
develop modeling parameters such as thermal interface
conductivities/resistances, orthotropic PCB conductivities, and
component junction temperatures. Experience using FEMAP is required.
In addition to competitive salaries, ZIN offers excellent benefits to our
associates, including medical, vision, and dental insurance; short- and
long-term disability; life insurance; paid leave and paid holidays;
401(k) retirement plan (immediate vesting); education and training
reimbursement; professional development opportunities; employee
assistance program; flexible spending plans; credit union membership;
and direct deposit.
ZIN-Technologies, Inc. is an Equal Employment Opportunity Employer
M/F/D/V