Master Thesis Simulation Laser Processing of Semiconductor Materials
- During your thesis you will build a comprehensive material model for SiC suitable for thermomechanical simulation.
- You will set up and run a thermomechanical Finite Element Method (FEM) simulation for laser material processing. This includes implementing of heat source and material properties to predict temperature fields, residual stresses, and potential crack formation.
- Furthermore, you will define, conduct, and analyze validation experiments to generate reference data, including the measurement of residual stresses.
- Finally, you will compare and validate your simulation results against the experimental data to refine the model.
Qualifications
- Education: Master studies in the field of Mechanical Engineering, Materials Science, Physics, or comparable
- Experience and Knowledge: simulation experience with FEM simulation and material modeling; prior experience with thermomechanical simulations or thermal joining simulations; experience or coursework related to semiconductor materials such as Silicon (Si) or Silicon Carbide (SiC) is an advantage
- Personality and Working Practice: you are a proactive and structured individual with a strong analytical mindset and the ability to work independently
- Work Routine: your on-site presence is required
- Languages: fluent in German and English
Additional Information
Start: according to prior agreement
Duration: 6 months
Requirement for this thesis is the enrollment at university. Please attach your CV, transcript of records, examination regulations and if indicated a valid work and residence permit.
Diversity and inclusion are not just trends for us but are firmly anchored in our corporate culture. Therefore, we welcome all applications, regardless of gender, age, disability, religion, ethnic origin or sexual identity.
Need further information about the job?
Michael Schänzel (Functional Department)
+49 711 811 8794
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